剥脱关节
范德瓦尔斯力
材料科学
胶粘剂
晶片切割
Crystal(编程语言)
复合材料
鳞片
纳米技术
计算机科学
化学
石墨烯
分子
有机化学
程序设计语言
图层(电子)
作者
Magdalena Tamulewicz‐Szwajkowska,Szymon J. Zelewski,J. Serafińczuk,R. Kudrawiec
出处
期刊:AIP Advances
[American Institute of Physics]
日期:2022-02-01
卷期号:12 (2)
被引量:13
摘要
To obtain molecularly thin flakes via mechanical exfoliation from a bulk layered crystal, the process should be repeated multiple times, but the mathematical principle behind this phenomenon remains unknown. In this paper, we show how the thickness of the MoS2 flake changes with subsequent cleavages of the adhesive tape, with the tests carried out on two widely used dicing tapes and Scotch removable tape. In the beginning, we assumed that with each subsequent tear of the tape, the thickness of the material decreases by half. We discovered that the exfoliated crystal thickness decreases with geometric progress and proposed a formula depicting that phenomenon. In addition, the exfoliated flakes are observed to crumble during the process and the fragmentation factor is discussed as well. Our observations will allow for more efficient estimation of the number of steps required to produce a sample of the desired thickness, relevant for tuning electronic transport properties and optical activity of two-dimensional materials.
科研通智能强力驱动
Strongly Powered by AbleSci AI