绝缘体上的硅
符号
硅
晶体管
材料科学
兴奋剂
简并能级
物理
数学
光电子学
凝聚态物理
量子力学
算术
电压
作者
Yu-Hung Liao,Khandker Akif Aabrar,Wriddhi Chakraborty,Wenshen Li,Suman Datta,Sayeef Salahuddin
标识
DOI:10.1109/led.2021.3135407
摘要
State-of-the-art Fully-Depleted Silicon-on-Insulator Transistors of different gate lengths were measured down to ${\text{L}}_{G}=20$ nm. A quasi-ballistic virtual source model was found to be in good agreement with the observed data for both NFET and PFET. The extracted injection velocity increases with decreasing channel length, as expected, reaching ${9.51}\times {10}^{{6}}\text {cm/s}$ for electrons and ${7.16}\times {10}^{{6}}\textit {cm/s}$ for holes at ${\text{L}}_{G}=20$ nm. These values are more than 80% of the thermal velocity in lightly-doped bulk silicon. Analysis shows that quantum confinement in the thin SOI channel as well as strain effects are potentially responsible for such ultra-high velocity. These results indicate that further scaling of the channel length could make it possible to approach the non-degenerate thermal velocity.
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