馈通
材料科学
液氦
泄漏
热导率
低温恒温器
氦
印章(徽章)
复合材料
低温学
热的
铜
热膨胀
Lambda point冰箱
接头(建筑物)
热力学
凝聚态物理
光电子学
超导电性
化学
冶金
艺术
视觉艺术
物理
建筑工程
有机化学
工程类
作者
Andrew D. Hibbs,D W Cox
摘要
A method for making a leak tight cryogenic joint between a copper rod and a material of much lower thermal expansion has been developed. No materials of high magnetic susceptibility are present in the seal. The technique has been used to make high conductivity thermal connections to components in the vacuum space of a liquid helium Dewar made from G10 fiberglass.
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