Effect of different parameters on machining of SiC/SiC composites via pico-second laser

机械加工 材料科学 激光器 激光功率缩放 复合材料 激光加工 形态学(生物学) 扫描电子显微镜 光学 冶金 激光束 遗传学 生物 物理
作者
Weinan Li,Ruoheng Zhang,Yongsheng Liu,Chunhui Wang,Jing Wang,Xiaojun Yang,Laifei Cheng
出处
期刊:Applied Surface Science [Elsevier]
卷期号:364: 378-387 被引量:75
标识
DOI:10.1016/j.apsusc.2015.12.089
摘要

Pico-second laser plays an important role in modern machining technology, especially in machining high hardness materials. In this article, pico-second laser was utilized for irradiation on SiC/SiC composites, and effects of different processing parameters including the machining modes and laser power were discussed in detail. The results indicated that the machining modes and laser power had great effect on machining of SiC/SiC composites. Different types of surface morphology and structure were observed under helical line scanning and single ring line scanning, and the analysis of their formulation was discussed in detail. It was believed that the machining modes would be responsible to the different shapes of machining results at the same parameters. The processing power shall also influence the surface morphology and quality of machining results. In micro-hole drilling process, large amount of debris and fragments were observed within the micro-holes, and XPS analysis showed that there existed Si–O bonds and Si–C bonds, indicating that the oxidation during processing was incomplete. Other surface morphology, such as pores and pits were discussed as well.

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