Highly thermally conductive polymer composite enhanced by constructing a dual thermal conductivity network

Abstract Constructing interconnected thermally conductive networks in a polymer matrix is essential for efficient heat transport in thermally managed materials. Thermally conductive network structures typically have meager thermal resistance, and heat transfer into the material is rapidly exported along such networks. However, increasing the thermally conductive networks inside the polymer matrix is still challenging. This paper prepared high thermal conductivity composites with “primary‐secondary” thermal conductivity networks by combining two processes: constructing three‐dimensional thermally conductive skeletal networks and physically blending fillers, using epoxy resin as the matrix. The performance test results showed that the thermal conductivity of the composites reached 1.65 W/(m K) when the boron nitride (BN) content reached 33.5 wt%, which was 842.8% and 150% higher than that of pure epoxy (EP) and composites with randomly dispersed fillers. This highly efficient heat transfer behavior is mainly due to the synergistic effect of the two‐level thermally conductive network, which weakens the scattering effect of phonons to a great extent. Also, the dielectric properties of the composite material, especially the transport of carriers inside the material under strong electric fields, were discussed in this paper. This work provides ideas and methods for preparing electrical and electronic devices applied to high power density.