Rapid cure composites in electronics industry

Rapid cure technologies of polymeric materials are highly desired in the field of the electrics industry for achieving both high throughput and performance. Despite the recent developments in ultraviolet-curable materials and heating assistant tools, the rapid cure composites in chip packaging are challenged on many fronts, including the compromise in processing parameters, facility-dependent presets, and design. This chapter provides basic cure systems frequently used in the chip packaging process and assembly components that need a fast cure profile during manufacturing. The basic concept, processing condition, composition, and required properties of surface mount adhesive, dicing die attach film, underfill, electrically conductive adhesive, and glob-top encapsulants are addressed. Finally, the prioritized properties to which the rapid cure composites are obliged, in accordance with the RoHS green initiatives and the state-of-the-art technologies in chip packaging, such as SoC, SiP, and heterogeneous packaging, are stated at the end of the chapter.