Development of Novel Photosensitive Polyimide with $170{ }^{\circ} \mathrm{C}$ Curing Process to Enable Low Warpage and Sub-$\mathbf{2} \mu \mathrm{m}$ Patterning for Rdls in Next Generation Interposer
聚酰亚胺
固化(化学)
物理
材料科学
光电子学
复合材料
图层(电子)
作者
Yusuke Murata,S. Horikawa,Mutsuo Inoue,Ryoji Tatara,Hirokazu Ito