Optimized Design of Micro‐TEC with Variable Cross‐Section Structure

Abstract The increasing heat flux in microelectronic device challenges traditional cooling methods. Thermoelectric coolers (TECs) offer effective hotspot management through direct integration with microelectronic components. However, their efficiency is limited by thermoelectric properties, resulting in high power consumption and additional thermal loads. This study introduces a 3D finite element model to optimize micro‐TEC with variable cross‐sections. Key parameters, including cross‐sectional area ratio ( s ), packing density ( p d ), leg center width ( w ), leg height ( l ), and external conditions (ambient temperature T m , heat load Q c ) are systematically analyzed. At T m = 90 °C and Q c = 1 W, with p d = 120 legs cm − 2 , l = 0.5 mm and identical TE leg volume, the novel design reduces power consumption from 1.97 W in traditional designs to 1.56 W, a reduction of 20.8%. Further optimization achieved a minimum power consumption of 1.43 W at T m = 90 °C, Q c = 1 W, p d = 528 legs cm − 2 , w = 0.2 mm, l = 0.2 mm and s = 6.85. These findings provide a framework for reducing TEC power consumption and material costs, advancing efficient cooling in microelectronics.