材料科学
电介质
失效机理
基质(水族馆)
钥匙(锁)
钢化玻璃
复合材料
介电损耗
法律工程学
计算机科学
工程类
光电子学
海洋学
计算机安全
地质学
作者
Qi An,Yuelei Xiao,Qiuxu Wei,Yung-Hsien Wu,Huiying Li,Yue Li
摘要
Due to high insulation, low dielectric loss and low cost, glass is considered as a promising substrate material for advanced package. Through glass via technology plays a key role in the 2.5D and 3D packaging. This paper analyzes failure mechanisms of TGV and discuss the optimum design and process.
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