材料科学
热电效应
塞贝克系数
微观结构
热导率
电阻率和电导率
粒度
功勋
粒径
热电材料
电子迁移率
声子散射
复合材料
光电子学
化学工程
电气工程
物理
热力学
工程类
作者
Babu Madavali,Pathan Sharief,Kyoung‐Tae Park,Gian Song,Song Yi Back,Jong‐Soo Rhyee,Soon‐Jik Hong
出处
期刊:Materials
[Multidisciplinary Digital Publishing Institute]
日期:2021-08-27
卷期号:14 (17): 4870-4870
被引量:17
摘要
Developing inexpensive and rapid fabrication methods for high efficiency thermoelectric alloys is a crucial challenge for the thermoelectric industry, especially for energy conversion applications. Here, we fabricated large amounts of p-type Cu0.07Bi0.5Sb1.5Te3 alloys, using water atomization to control its microstructure and improve thermoelectric performance by optimizing its initial powder size. All the water atomized powders were sieved with different aperture sizes, of 32–75 μm, 75–125 μm, 125–200 μm, and <200 μm, and subsequently consolidated using hot pressing at 490 °C. The grain sizes were found to increase with increasing powder particle size, which also increased carrier mobility due to improved carrier transport. The maximum electrical conductivity of 1457.33 Ω−1 cm−1 was obtained for the 125–200 μm samples due to their large grain sizes and subsequent high mobility. The Seebeck coefficient slightly increased with decreasing particle size due to scattering of carriers at fine grain boundaries. The higher power factor values of 4.20, 4.22 × 10−3 W/mk2 were, respectively, obtained for large powder specimens, such as 125–200 μm and 75–125 μm, due to their higher electrical conductivity. In addition, thermal conductivity increased with increasing particle size due to the improvement in carriers and phonons transport. The 75–125 μm powder specimen exhibited a relatively high thermoelectric figure of merit, ZT of 1.257 due to this higher electric conductivity.
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