材料科学
弯曲
硅
数码产品
非晶硅
纳米技术
无定形固体
多晶硅
柔性电子器件
工程物理
纳米线
微晶
复合材料
晶体硅
光电子学
薄膜晶体管
冶金
电气工程
结晶学
化学
图层(电子)
工程类
作者
Sang‐Il Park,Jong‐Hyun Ahn,Xue Feng,Shuodao Wang,Yonggang Huang,John A. Rogers
标识
DOI:10.1002/adfm.200800306
摘要
Abstract This paper describes materials and mechanics aspects of bending in systems consisting of ribbons and bars of single crystalline silicon supported by sheets of plastic. The combined experimental and theoretical results provide an understanding for the essential behaviors and for mechanisms associated with layouts that achieve maximum bendability. Examples of highly bendable silicon devices on plastic illustrate some of these concepts. Although the studies presented here focus on ribbons and bars of silicon, the same basic considerations apply to other implementations of inorganic materials on plastic substrates, ranging from amorphous or polycrystalline thin films, to collections of nanowires and nanoparticles. The contents are, as a result, relevant to the growing community of researchers interested in the use of inorganic materials in flexible electronics.
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