Analysis of the Parallel Seam Welding Process by Developing a Directly Coupled Multiphysics Simulation Model

Parallel seam welding (PSW) is the most commonly employed encapsulation technology to ensure hermetic sealing and to safeguard sensitive electronic components. However, the PSW process is complicated by the presence of multiphysical phenomena and nonlinear contact problems, making the analysis of the dynamics of the PSW process highly challenging. This paper proposes a multiphysics simulation model based on direct coupling, enabling the concurrent coupling of the electric field, temperature field, and structural field to facilitate the analysis of the thermal and electrical dynamics within the PSW process. First, this paper conducts an in-depth theoretical analysis of thermal and electrical contact interactions at all contact interfaces within the PSW process, taking into account material properties related to temperature. Second, the acquired data are integrated into a geometric model encompassing electrode wheels and ceramic packaging components, facilitating a strongly coupled multiphysics simulation. Finally, the experimental results show that the simulated weld area deviates by approximately 6.5% from the actual values, and the highest component temperature in the model exhibits an approximate 10.8% difference from the actual values, thus validating the accuracy of the model. This directly coupled multiphysics simulation model provides essentially a powerful tool for analyzing the dynamic processes in the PSW process.