Cure Monitoring and Control

Abstract This article discusses the attempts made by the industry to create sensing approaches for modeling a process, part, and chemistry and kinetics. It reviews microwave curing of thick-section composites and the resin cure sensors that are used for resin cure monitoring. These include dielectric cure sensors, fiberoptics-based resin cure sensors, ultrasonics-based resin cure sensors, and dosimetry-based resin cure sensors. The article provides information on the resin cure control flow sensing, flow modeling, flow mapping, and resin flow. It addresses some practical issues in sensing resin cure and flow.