Influence of the Cu content on the electrochemical corrosion performances of Ni60 coating

The effect of element Cu on microstructures and corrosion behavior of the directional structure Ni-based coatings were investigated experimentally. The element Cu enhanced the orientation growth of the coating microstructures, and the coating of Ni60/5 %Cu exhibited the highest corrosion potential (−0.236 V) and the smallest current density (1.238 ×10-6A/cm2). The corrosion resistance of the coating declined with increased Cu content, when the content of Cu reached 20 %, the corrosion potential and current density of the coating dropped to − 0.380 V and 2.100 × 10-6A/cm2, respectively, but they were still better than that of the coating without Cu element, which were − 0.395 V and 2.858 × 10-5A/cm2, respectively.