中间层
带宽(计算)
光电子学
镜像
材料科学
光学
电气工程
物理
计算机科学
工程类
电信
沟通
蚀刻(微加工)
社会学
复合材料
图层(电子)
作者
Gengtao Zhang,Haojie Chen,Yang Yang,Shenglin Ma,Yufeng Jin
标识
DOI:10.23919/icep55381.2022.9795370
摘要
Based on stacked through glass via (TGV) interposers, a dual-polarized antenna-in-package is proposed for 5G application. The antenna element shows a 4.3 GHz (25.8 - 30.1 GHz) bandwidth, fully covering the n257 band (26.5 - 29.5 GHz), and good radiation performance with a 5.2 dBi gain and cross-polarization suppression higher than 35 dB at 28 GHz. Owing to the differential feeding networks, it displays high port isolation of more than 35 dB within the bandwidth. A 2 × 2 antenna subarray with an embedded IC in mirroring configuration is demonstrated to improve cross-polarization suppression by 12 dB compared with regular configuration.
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