Research on Curing Mechanism of Bisphenol-A Epoxy Resin by DSC

Curing reaction of bisphenol-A epoxy resin were researched by non-isothermal DSC. The experiment result showed that the cured structure were excellent when the proportion between the bisphenol-A epoxy resin DER331 and curing agent DEH622 was 100:30, the reaction heat was 358.53 J/g which is 4 to 9 times higher than the heat released by other different ratios. Initial curing temperature was 36.35C which is the lowest among all different ratios, curing peak temperature was lower 10C to 40C than other proportion. Thus, optimum proportion between the DER331 epoxy resin and the DEH622 curing agent is 100:30.