材料科学
光电子学
波导管
集成电路
制作
光子晶体
电子线路
作者
Aaron Zilkie,Pratul P. Srinivasan,Andrea Trita,Thomas Schrans,Guomin Yu,Jerry Byrd,David A. Nelson,Karl Muth,Damiana Lerose,Mazin Alalusi,Kevin Masuda,Mélissa Ziebell,Hooman Abediasl,J. Drake,Gregory H. Miller,Henri Nykänen,Evie S. Kho,Yangyang Liu,Hong Liang,Hua Yang,Frank Peters,A.S. Nagra,A.G. Rickman
标识
DOI:10.1109/jstqe.2019.2911432
摘要
We describe and characterize a multi-micron silicon photonics platform that was designed to combine performance, power efficiency, manufacturability, and versatility for integrated photonic applications ranging from data communications to sensors. We outline the attributes needed for broad applicability, high-volume manufacturing, and large-scale deployment of silicon photonics, and describe how the platform is favorable with respect to these attributes. We present demonstrations of key technologies needed for the communications and sensing applications, including low-loss fiber attach, compact low-loss filters, efficient hybrid wavelength division multiplexed lasers, and high-speed electro-absorption modulators and integrated photodetectors.
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