粘着
粘附
静摩擦
材料科学
复合材料
还原(数学)
纳米技术
微电子机械系统
几何学
数学
出处
期刊:Journal of vacuum science & technology
[American Institute of Physics]
日期:2003-11-01
卷期号:21 (6): 2262-2296
被引量:479
摘要
Solid–solid adhesion occurs at contacting asperities in two contacting solids. A thin liquid film with a small contact angle, present at the interface, can result in the so-called liquid-mediated adhesion. This may result in high adhesion during normal pull and high static friction during sliding, both commonly referred to as “stiction.” The problem of high stiction is especially important in an interface involving two very smooth surfaces under lightly loaded conditions. This article provides a critical and comprehensive review of mechanisms of adhesion and stiction, various measurement techniques, and methods used to reduce stiction in magnetic storage devices and micro/nanoelectromechanical systems.
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