纳米复合材料
材料科学
电介质
X射线光电子能谱
聚乙烯
聚合物纳米复合材料
傅里叶变换红外光谱
介电常数
聚合物
介电强度
复合材料
电子顺磁共振
化学工程
核磁共振
光电子学
物理
工程类
作者
M. Roy,J. K. Nelson,R.K. MacCrone,Linda S. Schadler,C. W. Reed,R.J. Keefe,W. Zenger
标识
DOI:10.1109/tdei.2005.1511089
摘要
The incorporation of silica nanoparticles into polyethylene increased the breakdown strength and voltage endurance significantly compared to the incorporation of micron scale fillers. In addition, dielectric spectroscopy showed a decrease in dielectric permittivity for the nanocomposite over the base polymer, and changes in the space charge distribution and dynamics have been documented. The most significant difference between micron scale and nanoscale fillers is the tremendous increase in interfacial area in nanocomposites. Because the interfacial region (interaction zone) is likely to be pivotal in controlling properties, the bonding between the silica and polyethylene was characterized using Fourier transformed infrared (FTTR) spectroscopy, electron paramagnetic resonance (EPR), and x-ray photoelectron spectroscopy (XPS). The picture which is emerging suggests that the enhanced interfacial zone, in addition to particle-polymer bonding, plays a very important role in determining the dielectric behavior of nanocomposites.
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