3-D Packaging Technologies for Advanced Integrated Photonics Modules: A Review

Recent developments in photonics applications, in the fields of datacom, high-performance computing and integrated optical sensors, have accelerated the trend towards electronic/optical convergence announced over ten years ago. The growing maturity of silicon photonics and its use in conjunction with advanced packaging techniques (3D stacking, TSV, fan-out wafer level packaging, etc.) have contributed to the emergence of two new objects that are becoming standards: Co-packaged Optics (CPO), and Photonic Interposers, both leveraging Photonic chiplets. This article reviews the emergence of these two objects, as well as the most recent achievements.