Mechanically Flexible Interconnects With Contact Tip for Rematable Heterogeneous System Integration

A wafer-level, batch-fabricated, mechanically flexible interconnect (MFI) with a contact tip has been developed for rematable heterogeneous system integration. The contact tip, which exhibits a truncated-cone profile, enhances the scrubbing capability while maintaining the tip lifetime by avoiding tip plastic deformation. Electrical and mechanical characterization has been conducted on various testbeds to verify the performance of the assembled chip links with MFIs. The results indicate that a single MFI has an average electrical resistance of 103.21 mQ and up to 1 A current carrying capability, and can be successfully assembled on nonplanar surfaces with up to 45-μm surface variation.