Chip-package co-design of a 5 GHz RF front-end for WLAN

Single-package integration of complete transceivers based on a thin-film MCM technology (MCM-D) with integrated passives is demonstrated with a 6.7/spl times/6.5 mm/sup 2/ single-package front-end. This front-end includes the RF blocks and two RF bandpass filters of a 5 GHz WLAN receiver.