材料科学
铜
粘结强度
复合材料
环氧树脂
胶粘剂
分层(地质)
薄膜
氧气
图层(电子)
冶金
纳米技术
古生物学
化学
有机化学
生物
俯冲
构造学
作者
Yuka Yamada,Shinji Fukumoto,Kozo Fujimoto
标识
DOI:10.2320/matertrans.mt-mc2022003
摘要
The bonding between copper and epoxy resin is investigated using a C–H–Si thin film to achieve highly adhesive and reliable bonding between the resin mold and the copper substrate in power modules. In this study, high-temperature (473 K) testing is performed to improve the reliability of this junction after high-temperature operation. The bond strength decreases and delamination occurs at the film–copper interface after high-temperature testing. The decrease in bond strength may be due to the decrease in the film–copper interfacial strength because of the decrease in the binding force between copper and oxygen upon heating. When Fe and Cr, which have high oxygen bond disassociation energies, are intercalated at the film–copper interface, the bond strength improves after high-temperature testing and a bond strength above 30 MPa was retained after 1000 h.
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