静态随机存取存储器
宏
足迹
堆栈(抽象数据类型)
电子线路
计算机科学
过程(计算)
频道(广播)
拓扑(电路)
电子工程
计算机硬件
工程类
电气工程
计算机网络
操作系统
古生物学
生物
程序设计语言
作者
Dawit Burusie Abdi,Shairfe Muhammad Salahuddin,Juergen Boemmels,Edouard Giacomin,Pieter Weckx,Julien Ryckaert,Geert Hellings,Francky Catthoor
出处
期刊:IEEE Transactions on Circuits and Systems I-regular Papers
[Institute of Electrical and Electronics Engineers]
日期:2023-05-18
卷期号:70 (7): 2858-2867
被引量:6
标识
DOI:10.1109/tcsi.2023.3272658
摘要
In this paper, we introduce a novel design of a 3D static random-access memory (SRAM) macro in a 3D Nanofabric process technology. The 3D Nanofabric technology is based on enabling the processing of N stack of identical layers simultaneously regardless of the number of stacked layers which consequently reduces the fabrication cost as well as the footprint of SRAM macros. To enable simultaneous patterning of stacked layers, 3D Nanofabric requires circuit topology and layout that rely on a single layer where the device channel, poly, and metal wires are all embedded without any other crossing than the gate on top of the device channel. Accordingly, we modify the layouts of the conventional SRAM bit-cell and periphery circuits which are complex and contain several metal crossings. Furthermore, we propose a new overall organization of the 3D SRAM macro that incorporates a stack of multiple identical layers each consisting of an equal size 2D array of bit-cells and the periphery circuits. We show that the proposed 3D Nanofabric SRAM macro offers 71.2% footprint gain and 36.3% read access speed improvement compared to equal size 2D SRAM macro in 3 nm FinFET.
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