复合材料
材料科学
热的
电子设备和系统的热管理
机械工程
物理
气象学
工程类
作者
Yingying Guo,Kang Xu,Yandong Wang,Zhenbang Zhang,Ping Gong,Jianxiang Zhang,Linhong Li,Rongjie Yang,Yue Qin,Xingye Wang,Boda Zhu,Tao Cai,Cheng‐Te Lin,Kazuhito Nishimura,Maohua Li,Nan Jiang,Jinhong Yu
出处
期刊:Nano Letters
[American Chemical Society]
日期:2025-02-07
标识
DOI:10.1021/acs.nanolett.4c04601
摘要
With the advancement of science and technology, effectively addressing the issue of heat dissipation in electronic equipment has become a key research topic. Polymers have attracted attention due to their low price, excellent flexibility, and lightweight characteristics, but thermal conductivity has a limitation. In this work, aiming for all-polymer composites with lightweight and high thermal conductivity, poly(p-phenylene benzobisoxazole) (PBO) fibers were used to construct a long-range ordered heat transfer path in the organosilicon matrix, and an all-organic composite material with a low density of 1.24 g cm-3 and thermal conductivity of 18.44 W/ (m K) was produced. At the same time, the composite material was applied to the cooling performance test of LED lamps, which was 4.8 °C lower than advanced commercial thermal conductive materials, demonstrating its potential in the field of thermal management materials.
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