纳米颗粒
材料科学
纳米技术
退火(玻璃)
多孔性
配体(生物化学)
薄膜
化学工程
化学
复合材料
生物化学
工程类
受体
作者
Jungwook Choi,Byung Hyo Kim
出处
期刊:Nanomaterials
[Multidisciplinary Digital Publishing Institute]
日期:2024-10-21
卷期号:14 (20): 1685-1685
被引量:22
摘要
Nanoparticle-based thin films are increasingly being used in various applications. One of the key factors that determines the properties and performances of these films is the type of ligands attached to the nanoparticle surfaces. While long-chain surfactants, such as oleic acid, are commonly employed to stabilize nanoparticles and ensure high monodispersity, these ligands often hinder charge transport due to their insulating nature. Although thermal annealing can remove the long-chain ligands, the removal process often introduces defects such as cracks and voids. In contrast, the use of short-chain organic or inorganic ligands can minimize interparticle distance, improving film conductivity, though challenges such as incomplete ligand exchange and residual barriers remain. Polymeric ligands, especially block copolymers, can also be employed to create films with tailored porosity. This review discusses the effects of various ligand types on the morphology and performance of nanoparticle-based films, highlighting the trade-offs between conductivity, structural integrity, and functionality.
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