Fabrication of Via-hole on Pyrex7740 Glass Wafer by HF Wet-etching Technique

This paper reports fabrication of via - hole on Pyrex7740 glass wafer by wet - etching technique. Firstly silicon and glass wafers were anodically bonded together and glass wafer was thinned to about 100? m.Then three kinds of materials(such as PECVD SiC and Poly -Si and W/Au) were prepared and patterned as hard - mask respectively.Lastly via - holes were realized by 40%HF wet - etching on glass wafer.This process is very simple,low price and IC compatible.The vertical and lateral etching processes were studied and profile of the via - hole was observed.The masking impact of three kinds of hard - masks was compared.This work can be useful for the fabrication of some MEMS device, especially wafer - level vacuum package.