波分复用
光子集成电路
光子学
谐振器
收发机
光电子学
自由光谱范围
硅光子学
带宽(计算)
光学环形谐振器
炸薯条
光学滤波器
光学
材料科学
波长
电气工程
计算机科学
物理
工程类
电信
CMOS芯片
作者
Sikai Chen,Jintao Xue,Yihan Chen,Yuean Gu,Haoran Yin,Shenlei Bao,Guike Li,Binhao Wang,Nan Qi
出处
期刊:Custom Integrated Circuits Conference
日期:2024-04-21
卷期号:: 1-2
被引量:6
标识
DOI:10.1109/cicc60959.2024.10529008
摘要
The emerging AI computing system asks for high-speed, large-scale, and power-efficient interconnects. As the system scales-out reaching tens-of-meters, electrical links cannot support higher bandwidth (BW) at affordable power consumption. Silicon photonic (SiPh) technology enables the fabrication of both photonic integrated circuits (PIC) and electronic integrated circuits (EIC) on the same wafer. By integrating optical transceivers into the xPU package, fiber channels could be directly attached to the chip edge, building up the highly integrated optical-IO. SiPh micro-ring resonator (MRR) is an attractive solution due to small footprint and its capability of wavelength selection [1]–[3]. To fit more wavelengths into one full-spectral-range (FSR) of the MRR, dense wavelength-division multiplexing (DWDM) has been adopted, which brings design challenges on anti-aliasing and wavelength stabilizing.
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