LDMOS                        
                
                                
                        
                            碳化硅                        
                
                                
                        
                            材料科学                        
                
                                
                        
                            功率半导体器件                        
                
                                
                        
                            功率MOSFET                        
                
                                
                        
                            光电子学                        
                
                                
                        
                            击穿电压                        
                
                                
                        
                            半导体                        
                
                                
                        
                            兴奋剂                        
                
                                
                        
                            工程物理                        
                
                                
                        
                            半导体器件                        
                
                                
                        
                            电气工程                        
                
                                
                        
                            沟槽                        
                
                                
                        
                            功率(物理)                        
                
                                
                        
                            宽禁带半导体                        
                
                                
                        
                            电压                        
                
                                
                        
                            MOSFET                        
                
                                
                        
                            纳米技术                        
                
                                
                        
                            晶体管                        
                
                                
                        
                            工程类                        
                
                                
                        
                            图层(电子)                        
                
                                
                        
                            复合材料                        
                
                                
                        
                            物理                        
                
                                
                        
                            量子力学                        
                
                        
                    
            作者
            
                Ziwei Hu,Jiafei Yao,Ang Li,Qi Sun,Man Li,Kemeng Yang,Jun Zhang,Jing Chen,Maolin Zhang,Yufeng Guo            
         
                    
        
    
            
            标识
            
                                    DOI:10.1088/1674-4926/24010029
                                    
                                
                                 
         
        
                
            摘要
            
            Abstract Silicon carbide (SiC), as a third-generation semiconductor material, possesses exceptional material properties that significantly enhance the performance of power devices. The SiC lateral double-diffused metal–oxide–semiconductor (LDMOS) power devices have undergone continuous optimization, resulting in an increase in breakdown voltage (BV) and ultra-low specific on-resistance ( R on,sp ). This paper has summarized the structural optimizations and experimental progress of SiC LDMOS power devices, including the trench-gate technology, reduced surface field (RESURF) technology, doping technology, junction termination techniques and so on. The paper is aimed at enhancing the understanding of the operational mechanisms and providing guidelines for the further development of SiC LDMOS power devices.
         
            
 
                 
                
                    
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