金属浇口
节点(物理)
CMOS芯片
微电子
绝缘体上的硅
电子工程
阈值电压
电气工程
栅极电压
工程类
缩放比例
电压
计算机科学
光电子学
材料科学
晶体管
栅氧化层
硅
数学
结构工程
几何学
作者
Dina H. Triyoso,Rick Carter,J. Kluth,S. Luning,Amy Child,Jeremy Wahl,Bob Mulfinger,Kasun Punchihewa,Anil Kumar,Laegu Kang,Ryan Sporer,Xiaobo Chen,S. Straub,Girish Bohra,Suraj Patil,Xing Zhang,Alex Chen,M. Togo,Rohit Pal
出处
期刊:ECS transactions
[Institute of Physics]
日期:2015-09-08
卷期号:69 (5): 103-110
被引量:3
标识
DOI:10.1149/06905.0103ecst
摘要
After decades of research, high-k metal gate has been successfully integrated into CMOS starting with the 45nm node. To continue scaling, the industry has chosen two integration approaches: FINFET with gate last and FDSOI with gate first. The FINFET with gate last integration was introduced into production at the 22nm node by Intel. The FDSOI with gate first integration was introduced into production at 28nm node by ST Microelectronics. There are some common factors impacting threshold voltage (Vt) on both integrations such as the high-k/metal gate film thickness and composition as well as the doping concentration. Beyond that, each integration approach has its own unique challenges that must be overcome to achieve targeted Vt and maintain Vt control. In this work we will highlight those unique challenges and discuss what knobs can be used to achieve the targeted Vt and maintain Vt control.
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