单片微波集成电路
共面波导
微波食品加热
放大器
桥(图论)
基质(水族馆)
材料科学
电气工程
光电子学
砷化镓
组分(热力学)
气隙(管道)
工程类
电子工程
物理
电信
地质学
复合材料
内科学
医学
CMOS芯片
热力学
海洋学
作者
N.H.L. Koster,S. Koblowski,R.M. Bertenburg,Stefan Heinen,I. Wolff
标识
DOI:10.1109/euma.1989.334045
摘要
Two principle types of air bridge realizations are distinguished. The different electrical behaviour of both types is pointed out. Measurements indicate significant losses and phase shifting. A variety of modifications of each type is built on GaAs substrate. Some hints for improved monolithic microwave integrated circuit (MMIC) design are offered. The air bridge T-junction is introduced as a new component. A travelling-wave amplifier (TWA) fabricated in coplanar waveguide (CPW) technique is presented as a design example using a minimum number of air bridges.
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