Measurements and Modeling of Atomic‐Scale Sidewall Roughness and Losses in Integrated Photonic Devices

Abstract Atomic‐level imperfections play an increasingly critical role in nanophotonic device performance. However, it remains challenging to accurately characterize the sidewall roughness with sub‐nanometer resolution and directly correlate this roughness with device performance. A method that allows to measure the sidewall roughness of waveguides made of any material (including dielectrics) using the high resolution of atomic force microscopy is developed. This method is illustrated by measuring state‐of‐the‐art photonic devices made of silicon nitride. The roughness of devices fabricated using both deep ultraviolet (DUV) photo‐lithography and electron‐beam lithography for two different etch processes is compared. To correlate roughness with device performance, a new Payne–Lacey Bending model is described, which adds a correction factor to the widely used Payne–Lacey model so that losses in resonators and waveguides with bends can be accurately predicted given the sidewall roughness, waveguide width and bending radii. Having a better way to measure roughness and use it to predict device performance can allow researchers and engineers to optimize fabrication for state‐of‐the‐art photonics using many materials.