铜
镀铜
材料科学
复合数
冶金
电镀(地质)
水解
图层(电子)
氧化物
水溶液
酒石酸盐
化学工程
无机化学
复合材料
化学
物理化学
工程类
地质学
生物化学
电镀
地球物理学
作者
Hoang Tri Hai,Jong Gwan Ahn,Dong Jin Kim,Jae Ryeong Lee,Y.N. Jang,Hun Saeng Chung,Chong Oh Kim
出处
期刊:Advanced Materials Research
日期:2006-02-15
卷期号:15-17: 570-574
标识
DOI:10.4028/www.scientific.net/amr.15-17.570
摘要
Copper powders with very dense, uniform silver coating layer were prepared by electroless plating method in aqueous system at room temperature. Silver-copper composite powders were obtained by strictly controlling the activation and complexing process variables such as NH4OH/(NH4)2SO4 molar ratio, tartrate concentration, and feeding rate of silver ion solution. The mechanism of composite powders formation and their characteristics were discussed. It is noted that completely cleansing the oxide layers and protecting the copper particles surface from hydrolysis are key factors to obtain high quality Ag-Cu composite powders.
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