Power Supply Design and Power Management in Complex System Design: Co-Packaged Optics-FPGA 3D SIP Module

In this work a Co-Packaged Optics-FPGA-Memory-Power supply 3D module, "LightSiP (TM) System-in-Package" is presented. The Power Supply Design discussed here is for a multi-functional system consisting of two FPGAs, 16 Memory chips, PCIe switch, PLL, System controller IC, Optical Interconnect, and other ICs. The 3-D stacked LightSiP (TM), is emerging as a viable option in addressing the increasing demands for data bandwidth in processing. Its unique architecture, which incorporates many ICs (I/O), necessitates thorough planning and analysis of the power distribution network (PDN) to ensure the effective functioning of the entire system interface. The module requires nine different VCC levels. We generated the required voltages from a single 12V ATX connector. In our study, we analyzed three distinct power supply circuits sourced from Renesas, Texas Instruments, and Analog Devices with a focus on efficiency. The assessment involved computing the total power requirements for our System-in-Package (SiP), determining the required number of components, and evaluating the overall power efficiency for a total power demand of 194W.