材料科学
泄漏(经济)
复合材料
聚酰亚胺
电介质
固化(化学)
热稳定性
化学工程
纳米技术
化学
光电子学
有机化学
聚合物
图层(电子)
经济
宏观经济学
工程类
作者
Peiyuan Zuo,Jinpeng Li,Donglin Chen,Na Lin,Gengchiau Liang,Jingyu Lin,Qixin Zhuang
出处
期刊:Materials horizons
[The Royal Society of Chemistry]
日期:2024-01-01
卷期号:11 (1): 271-282
摘要
The all-organic high-temperature polymer dielectrics with promising scale-up potential have witnessed much progress in the energy storage area, etc. However, the electron suppression trap mechanisms behind many all-organic dielectrics are still unclear, especially for high temperature resistant poly(p-phenylene benzobisoxazole) (PBO) polymers. To resolve this tough issue, we herein innovatively prepared PBO-based all-organic thin films containing sulfone-based polyimide (P(DSDA-ODA)) functioning as an electron trap phase using a facile and scalable co-curing method. The great linear dielectric properties of the prepared P(DSDA-ODA)/PBO films hold high dielectric thermal stability over the temperature range from 25 °C to 200 °C. The 60 wt% P(DSDA-ODA) systems yield the lowest leakage current (3.8 × 10-8 A cm-2). The tight structure and reduced leakage current enable an enhanced breakdown strength of 60 wt% P(DSDA-ODA)/PBO (470 kV mm-1), which is 1.7 times that of pure PBO. Meanwhile, it can reach 4.16 J cm-3 of energy density, which is 257% higher than that for pure PBO thin films while concurrently maintaining a long stable charge-discharge cycle (at least 5000 times) and high charge-discharge efficiency at 85.10%. Moreover, P(DSDA-ODA)/PBO still exhibits excellent energy storage performance at high temperature compared to PBO. This innovative strategy is further verified by replacing P(DSDA-ODA) with P(6FDA-ODA), and therefore lays a solid foundation for more investigation on scalable all-organic dielectrics.
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