材料科学
气凝胶
热导率
环氧树脂
复合材料
石墨烯
复合数
极限抗拉强度
填料(材料)
纳米技术
作者
Zijian Lu,Wei Wu,Dietmar Drummer,Yi Wang,Chao Liu,Shuo Li,Xintong Zhao
摘要
Abstract It is of great significance to study new thermal conductivity filler in practical thermal management application. In this study, a multi‐scale assembled thermal conductivity composite Al 2 O 3 ‐ZnO NWs/GO/EP was developed. The test results showed that the composite has good thermal conductivity and mechanical properties with low filler content. When the GO content is 1.5 wt% and the Al 2 O 3 ‐ZnO NWs content is 25 wt%, the thermal conductivity of the composites reaches 2.15 W/mK, which is improved by about 1032% compared with the pure epoxy resin, and the tensile strength of the composites is maintained at a high level. The problems of high filling capacity and poor mechanical properties of alumina filler were effectively solved. It provides a new idea for preparing the filled thermal conductivity composites with low filling capacity and high thermal conductivity.
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