Direct metallization of polymers: The HiPIMS effect on early thin film growth

• The early growth of silver (Ag), gold (Au), and copper Cu thin films deposited via direct current magnetron sputtering (DCMS) and high-power impulse magnetron sputtering (HiPIMS) on various polymer substrates is monitored and understood. • The choice of metal and polymer strongly affect the resulting thin film morphology. • HiPIMS generally increases surface coverage and electrical conductivity across various metal and substrate combinations. • HiPIMS leads to a higher density of cluster for Ag and Au, but an unexpectedly lower cluster density for Cu. • These findings provide valuable insights into tuning metal film growth on polymers, with significant implications for metallization in applications such as optoelectronics, sensors, and flexible electronics. The metallization of polymers is essential for developing flexible electronics, yet precise control over metal film growth remains challenging. This study demonstrates the effect of high-power impulse magnetron sputtering (HiPIMS) markedly influencing the early-stage development of silver, gold, and copper thin films on various polymers compared to direct current magnetron sputtering (DCMS). Through advanced characterization techniques, including scanning electron microscopy and grazing-incidence small-angle X-ray scattering, it is discovered that HiPIMS leads to distinct nucleation patterns, resulting in superior surface coverage and reduces electrical resistance. Intriguingly, HiPIMS increases cluster density for silver and gold while decreasing it for copper, revealing its unique ability to tune metal-specific growth properties. These findings provide valuable insights into optimizing metal-polymer interfaces, with far-reaching implications for optoelectronics, sensors, and flexible electronics.