包对包
球栅阵列
材料科学
计算机科学
有限元法
包装设计
印刷电路板
电子包装
四平无引线包
弯曲
焊接
可靠性(半导体)
作者
Fa Xing Che,Yeow Chon Ong,Hong-Wan Ng,Chong Leong Gan,Christopher Glancey,Hem Takiar
出处
期刊:Electronics Packaging Technology Conference
日期:2020-12-02
标识
DOI:10.1109/eptc50525.2020.9315126
摘要
Package strength becomes challenging and issue for thin package used in mobile application. Package with low strength may result in package failure such as inside die cracking or package cracking through epoxy mold compound (EMC) when package is subjected to external loading from assembly process or field application. Package design and strength assessment methodology are essential for robust package used in mobile application. In this study, uMCP package is selected to demonstrate package strength investigation and improvement. Three-point bend (3PB) testing approach and finite element analysis (FEA) method are adopted for package strength study. A strain-controlled methodology is developed for package strength assessment. FEA simulation results show that mold cap thickness and mold clearance are 2 key factors for package strength. Die strength is another key factor for robust package strength design. In addition, effect of EMC material on package strength is also investigated.
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