Testing of Chiplet-Based Packages Based on Advanced Heterogeneous Integration

Editor’s notes: With 3-D chips becoming main-stream to address the growing demands of heterogenous integration, their test has moved from research to practical necessity and adoption. This article provides a comprehensive overview of what causes defects and anomalies due to imperfections in complex integration, and different methods to detect them at time zero and in the field. —Rubin Parekhji, Texas Instruments, India