材料科学
热等静压
合金
冶金
紧迫的
铜
退火(玻璃)
软化
复合材料
极限抗拉强度
热的
硬化(计算)
融合
铜合金
粉末冶金
激光器
沉淀硬化
复合数
压实
热压
温度循环
加工硬化
猝灭(荧光)
拉伸试验
微观结构
作者
Lorena Emanuelli,M. Pellizzari,Chad Beamer,Kathy L. Hayrynen,Faraz Deirmina
标识
DOI:10.1177/00325899261425372
摘要
C-18150 is a precipitation hardening copper alloy that has increasingly gained interest in additive manufacturing (AM) for applications in space, aerospace, electronics and automotive due to its excellent combination of electrical and thermal conductivity, thermal softening resistance at elevated temperatures, moderate strength, and high ductility. In this work, the effect of post-processing thermal treatments on the tensile properties of C-18150, fabricated by laser powder-bed-fusion (L-PBF), using high productivity printing parameters, was investigated. For this purpose, the reference as built and aged (480°C, 5 h) samples were compared with those of post-processed, prior to final ageing, under different conditions: (i) solution annealing (980 °C, 3 h), (ii) hot isostatic pressing (HIP) (950 °C, 150 MPa), followed by solution annealing, and (iii) HIP (980 °C, 150 MPa) followed by uniform rapid quenching aimed at eliminating the solution annealing step. Tensile behaviour was discussed in view of microstructural evolution and defects (e.g. porosity) in relation to the post-processing thermal treatments.
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