Fabrication of microstructured copper on an indium–tin–oxide surface using a micropatterned self-assembled monolayer as a template

The difference in chemical reactivity between indium–tin–oxide (ITO) and self-assembled monolayer (SAM) surfaces was used to fabricate copper (Cu) microstructures. ITO substrates coated with octadecyltrimethoxysilane (ODS)–SAM were photolithographically micropatterned using vacuum ultraviolet (VUV) light. Each of the micropatterned samples was subsequently immersed in an electrodeposition bath in order to deposit Cu on its surface. As confirmed by atomic force microscopy, Cu electrodeposition proceeded selectively on the VUV-irradiated areas of the ITO surface while the ODS–SAM surface served effectively as a mask to block Cu deposition. Cu microstructures with 7.5 × 7.5 μm2 features were successfully fabricated on the ITO surface.