材料科学
铜
固溶体
合金
电阻率和电导率
电导率
冶金
过饱和度
导电体
沉淀硬化
硬化(计算)
复合材料
热力学
化学
电气工程
工程类
物理
物理化学
图层(电子)
作者
Kazunari Maki,Yuki Ito,Hirotaka Matsunaga,Hiroyuki Mori
标识
DOI:10.1016/j.scriptamat.2012.12.027
摘要
Solid-solution copper alloys are standard and widely used conductive materials. However, it is generally considered difficult to significantly improve the balance between the strength and electrical conductivity of these alloys. Here, we designed copper alloys that exhibit high strength and conductivity by using solid-solution hardening enhanced by supersaturation with Mg. Cu–Mg alloy has a conductivity at least three times higher than that of the representative solid-solution Cu–Sn, while retaining comparable strength. Cu–Al–Mg alloy showed greater strength and conductivity than Cu–Sn.
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