CMOS芯片
缩放比例
饱和电流
材料科学
MOSFET
泊松分布
电子工程
饱和(图论)
光电子学
电气工程
晶体管
工程类
数学
统计
电压
几何学
组合数学
作者
Lijuan Ma,Xiaoli Ji,Zhaoxing Chen,Yiming Liao,Yan Feng,Yongliang Song,Qiang Guo
标识
DOI:10.7567/jjap.53.04ec15
摘要
The saturation current variability σ(δ I dsat ) and lifetime variability in hot carrier injection (HCI) have been investigated for deeply scaled nMOSFETs. It is found that both of them are getting worse with scaling down. The statistical analysis of the large data sets from various CMOS sizes shows that σ(δ I dsat ) is dominated by the total number of Poisson-distributed defects generated by HCI stress and the length ( L ) and width ( W ) of these devices. We attempt to use a single parameter to accurately describe HCI variability in deeply scaled nMOSFETs.
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