材料科学
热导率
石墨烯
微电子
氮化硼
复合材料
六方氮化硼
电子设备和系统的热管理
热传递
热的
复合数
纳米技术
机械工程
墨水池
物理
气象学
工程类
作者
Haoming Fang,Shu‐Lin Bai,Ching Ping Wong
标识
DOI:10.1016/j.coco.2016.10.002
摘要
Abstract Thermal management is more and more crucial in advanced electronic devices with increasing power density. So, the demand for the materials with high thermal conductivity is rising. Hexagonal boron nitride (h-BN), called as “white graphene”, has high thermal conductivity of ~2000 W m −1 K −1 (by theoretical calculation) and is an electrical insulator, so h-BN filled polymer composite becomes a good candidate for potential employment in heat management of microelectronic devices. This paper gives a brief review on the development of h-BN based polymeric composites, including thermal transfer mechanism, fundamental design principle and application, as well as perspectives.
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