High Temperature Cofired Ceramic (HTCC), Low Temperature Cofired Ceramic (LTCC), and Ultralow Temperature Cofired Ceramic (ULTCC) Materials

The rapid development in the microelectronic industry has created a high demand for low loss microwave ceramics due to their reliability, high integration potential, and good dielectric properties. Multilayer ceramic technology can be divided into three parts: high temperature cofired ceramics (HTCC) (sintering temperature <950 ºC), low TCC (LTCC) (sintering temperature 700-950 ºC), and ultralow TCC (ULTCC) can be produced by water-based techniques. Water-based tape casting is more environment friendly, inexpensive, and limits the CO2 emissions as compared to the organic solvent-based tape casting. For an effective tape casting, well-dispersed and stable ceramic slurry is essential. The microwave dielectric properties of ceramics with glass additives strongly depend on the densification, microstructure, and interactions between glass and ceramics.