Rotary Spatial Plasma Enhanced Atomic Layer Deposition — An enabling manufacturing technology for µm-thick ALD films
作者
Sami Sneck,Mikko J. Söderlund,Markus Bosund,Pekka J. Soininen
出处
期刊:日期:2017-03-01卷期号:: 1-2被引量:2
标识
DOI:10.1109/cstic.2017.7919810
摘要
Atomic Layer Deposition (ALD) is well known for its high film quality and high conformality, but limited by the low deposition rate. Beneq proposes a novel approach using Rotary Spatial Plasma Enhanced ALD process, which can reach deposition rates 10× higher than traditional pulsed ALD. This technology also enables use of PEALD in batch mode with high throughput. This paper describes the technology in more details.