薄膜晶体管
材料科学
晶体管
非晶硅
集成电路
多晶硅
工程物理
电子线路
GSM演进的增强数据速率
CMOS芯片
纳米技术
硅
计算机科学
电气工程
光电子学
晶体硅
工程类
电信
电压
图层(电子)
作者
Anzhi Yan,Chunlin Wang,Jianlan Yan,Zhenze Wang,Eva Zhang,Dong Yu,Zhaoyi Yan,Tian Lu,Tianrui Cui,Ding Li,Penghui Shen,Yuxin Jin,Houfang Liu,Yi Yang,Tian‐Ling Ren
标识
DOI:10.1002/adfm.202304409
摘要
Abstract High‐performance thin‐film transistors (TFTs) integrated circuits (ICs) have become increasingly necessary to meet the emerging demands such as healthcare, edge computing, and the Internet of Things, etc. This article aims to point out the potential development trends and bottlenecks of TFT ICs, enhancing their performance in terms of electronic performance, stability, consistency, CMOS design, and manufacturing capability. Basic device structures and overall metrics of TFT ICs are explored, as well as their superiority compared to silicon‐based ultrathin chips. Hydrogenated amorphous silicon, low‐temperature polycrystalline silicon, and amorphous oxide semiconductors are widely used in displays due to their ability to be deposited on large areas at low processing temperatures and low cost, and are validated in many prototypes for TFT ICs. Their conduction mechanisms, process flows, performance evaluation, and recent advances are comprehensively viewed. In addition, the potential of emerging low‐dimensional materials as next‐generation channel materials is discussed, along with their limitations and progress in this field. Finally, the major challenges in manufacturing high‐performance TFT ICs and future perspectives are summarized.
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