硅
离子液体
铝
离子键合
材料科学
化学工程
无机化学
纳米技术
化学
冶金
离子
有机化学
催化作用
工程类
作者
Krishna Venkatesh,Adriana Ispas,Andreas Bund
出处
期刊:ECS transactions
[The Electrochemical Society]
日期:2024-09-27
卷期号:114 (6): 167-173
标识
DOI:10.1149/11406.0167ecst
摘要
Electrodeposition of aluminum-silicon films in 1-ethyl-3-methylimidazolium chloride: aluminum chloride (1:1.5 molar ratio) was studied in the presence of different silicon halides. The silicon content in the deposited films was investigated as a function of the type and the concentration of various Si precursors. Using pulse plating technique, Al-Si films with Si content between 2 - 12.9 at. % could be obtained on copper substrates at room temperature.
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