结温
材料科学
光电子学
工程物理
MOSFET
温度测量
碳化硅
电气工程
电子工程
凝聚态物理
复合材料
热的
电压
工程类
热力学
晶体管
物理
作者
Han Cao,Puqi Ning,Yunhao Huang,Xuhui Wen
标识
DOI:10.17775/cseejpes.2021.04840
摘要
Compared to Si devices, the junction temperature of SiC devices is more critical due to the reliability concern introduced by immature packaging technology applied to new material. This paper proposes a practical SiC MOSFET junction temperature monitoring method based on the on-state voltage $\boldsymbol{V}_{\mathbf{ds}(\mathbf{on})}$ measurement. In Section II of the paper, the temperature sensitivity of the on-state voltage $\boldsymbol{V}_{\mathbf{ds}(\mathbf{on})}$ is characterized. The hardware of the measurement system is set up in Section III, which consists of an On-state Voltage Measurement Circuit (OVMC), the sampling and isolation circuit. Next, a calibration method based on the self-heating of the SiC MOSFET chip is presented in Section IV. In the final Section, the junction temperature is monitored synchronously according to the calibration results. The proposed method is applied to a Buck converter and verified by both an Infrared Radiation (IR) camera and a Finite Element Analysis (FEA) tool.
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