CMOS芯片
可靠性(半导体)
纳米-
比例(比率)
存水弯(水管)
电子工程
电子线路
降级(电信)
计算机科学
半导体器件建模
物理
材料科学
电气工程
工程类
量子力学
功率(物理)
气象学
复合材料
作者
Xiaoyan Liu,Mengqi Fan,Yuanzhao Hu,Haoling Li,Fei Liu,Jinfeng Kang
标识
DOI:10.1109/iedm45625.2022.10019403
摘要
Complex multi-physics effects in advanced CMOS pose great challenges to the modeling and simulation of devices and circuits. Multi-scale and multi-physics simulation methods are proposed aiming to investigate and evaluate various reliability problems (self-heating effect, trap-induced degradation and electro-migration of interconnects) with maximum accuracy and efficiency.
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